Copper-plated
Copper plating is a widely used undercoat in the electroplating industry. It is applied to soldered components, lead–tin alloys, and zinc die‑cast parts prior to nickel, gold, or silver plating to enhance coating adhesion. Copper deposits are an essential component of protective‑decorative copper/nickel/chromium systems; their ductility and low porosity play a critical role in improving interlayer adhesion and corrosion resistance. Copper plating is also employed for localized carburization prevention, through‑hole metallization on printed circuit boards, and as a surface layer on printing rollers. After chemical treatment, colored copper coatings, when topped with an organic film, can serve decorative purposes. The most commonly used copper‑plating solutions today are cyanide‑based, sulfate‑based, and pyrophosphate‑based baths.
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