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Alkaline cyanide‑free copper plating is an environmentally friendly pre‑plating process that contains no highly toxic cyanides, instead using organic complexing agents to coordinate copper ions. The resulting coating exhibits fine crystallinity and excellent adhesion, making it suitable for pre‑plating on substrates such as steel and zinc alloys. It can replace conventional cyanide‑based pre‑copper plating, thereby reducing environmental regulatory pressures. With a broad process window and excellent stability, it is often employed as an intermediate layer to enhance the adhesion of subsequent platings and is widely used in precision components and as a preparatory step in surface‑treatment workflows.
SanYong—A proprietary process formulation developed in-house by Harbin Institute of Technology, offering surface‑plating services on a contract basis only. Key features: high current efficiency ≥70%, fast plating rate, low hydrogen evolution, and reduced hydrogen embrittlement. The plating bath exhibits excellent stability, with outstanding throwing power and deep‑plating capability.
SanYong— the result of a research collaboration between Harbin Institute of Technology and SanYong—has developed the SY‑585 low‑stress alkaline zinc–nickel alloy electroplating process, which is capable of producing and supplying plating additives. The coating performance meets or exceeds that of Dipsol IZ‑17, the standard adopted by U.S. defense contractors and Boeing, making it a viable alternative to cadmium plating. As a Harbin Institute of Technology–SanYong solution for replacing cadmium plating in military‑grade applications, SY‑585 has been successfully submitted under “Operation HY” and is now being implemented at multiple defense‑industry enterprises.
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